Hi team,
My customer use flow soldering.
so connecting thermal pad to GND is difficult.
is it okay to leave thermal pad open, if they dont care about thermal dissipation?
best regards,
Takuya
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Hi team,
My customer use flow soldering.
so connecting thermal pad to GND is difficult.
is it okay to leave thermal pad open, if they dont care about thermal dissipation?
best regards,
Takuya
Hi Takuya,
It is okay to leave the thermal PAD not connected. As you understand, the downside would be that the RQJA of the IC will increase and cause the IC to reach thermal Shutdown faster in case of fault conditions.
When the thermal PAD of TPS2596 is not soldered, you can expect the RQJA to be similar to that of TPS25921 as shown below,