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LM2941QML-SP: package information required for thermal analysis

ashok kumar3
Prodigy 180 points
Part Number: LM2941QML-SP

For thermal analysis of this IC  LM2941QML (5962-9166703QYA), we need following information (material content report).

·         Weight

·         Component core material

·         Component package material

·         Metal lid material

·         Metal lid coating

·         Surface color of package  (other than metal lid)

·         IR emittance of package

·         Pin lead core material

·         Pin lead coating material

·         Is metal lids (@ top and/or bottom) are electrically grounded.

·         Is .stp or .step file available for these packages?

  • 0
    TI__Mastermind 28455 points

    Hey Ashok,

    I am working on gathering as much of this information as possible.

    I will give updates as information comes in.

    Thanks,

    Daniel

  • 0 in reply to Daniel Hartung
    TI__Mastermind 28455 points

    Hey Ashok,

    I received answers to some of the questions you have.

      Weight is still being worked on

    ·         Component core material Ceramic

    ·         Component package material Ceramic

    ·         Metal lid material Ceramic

    ·         Metal lid coating No Coating

    ·         Surface color of package  (other than metal lid) Black

    ·         IR emittance of package Not obtainable

    ·         Pin lead core material Alloy 42

    ·         Pin lead coating material 63 Sn/37 Pb

    ·         Is metal lids (@ top and/or bottom) are electrically grounded. Not a metal lid

    Still working on the .stp file if I can obtain one.

    Thanks,

    Daniel

  • 0 in reply to Daniel Hartung
    TI__Mastermind 28455 points

    I just received information that the weight is 647.2 mg.

    Thanks,

    Daniel