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BQ25790: ADC TDIE

Part Number: BQ25790

Hi,

We'd like to make use the TDIE function from ADC to get the die temperature.  Two related questions as below.

  • If ADC_RATE is configured as "Continuous" mode, how often will the chip do A-to-D conversion?  Will it pause for any reason?
  • Based on the internal die temperature reading from TDIE, how can we calculate the temperature outside/around the chip?

Thanks!

Antony

  • Hi Antony,

    The completion time for each measurements depends on the sample size/resolution selected. For example, highest resolution requires 24ms per conversion per the   If you perform all ADC measurements, the time is 24ms*11=264ms.  There is likely a small delay before the next continuous measurement in the same 10-20 ms timeframe but that is not spec'd.

    You can use the thermal information in d/s section 8.4 and the appnote at the link below the thermal data table to compute top of package or board temp.

    Regards,

    Jeff