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LMG1205: Is underfill recommended for this device?

DustinNH
Prodigy 30 points
Part Number: LMG1205

Hi, my question relates to the voltage spacing of the pins on the LMG1205 gate driver. This part is rated for 100V between the floating high side and the low side, or 90V "recommended." The distance through the air between the solder balls is about 0.12mm. In the layout, the HS pins are directly adjacent to the LOH and VDD pins, which means there would be roughly 90V across that air gap at the max recommended voltage. IPC-2221 recommends 0.5mm for this voltage range uncoated, or 0.13mm if coated. 

Do you recommended underfill for this part if operated at higher voltages like 50-100V in order to consider it "coated"? Or have you found this spacing is not a concern and the IPC spec is overly conservative? Do you have a recommended underfill for operating at 100C ambient temperature?

Thank you, Dustin

  • 0
    TI__Genius 13445 points

    Hi Dustin,

    Thanks for reaching out.

    The device has been tested and widely used in applications with bus voltages up to 100V. Having said, given the spacing and the expected operating voltages, special care must be taken into account during the layout specifically PCB traces from low voltage and high voltage pins. An underfill would help but is not required for proper operation of the driver IC.

    You may use the driver IC EVM design files available for your reference. These files may used as guidelines only and be updated according to application requirements.

    https://www.ti.com/tool/LMG1205HBEVM

    Regards,

    -Mamadou