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CSD19537Q3: CSD19537Q3 Thermal

Part Number: CSD19537Q3
Other Parts Discussed in Thread: CSD19538Q2

Hi Team,

My customer is considering CSD19537Q3 for 1A output current in Digital Output Module. In the datasheet, to achieve required thermal performance (Rtheta JA = 55 deg C/W), the heat sink area required is 6.45 cm.sq FR-4 board. The max dimensions available in customer pcb is 6 mm * 8 mm and also they can implement thermal vias on 6 layer board.

 With this operating condition can you please to calculate temp rise and suggest the possibility of using  CSD19537Q3 for this application.

Regards, Shinu Mathew. 

  • Hello Shinu Mathew,

    Thanks for promoting TI FETs at your customers. Is the CSD19537Q3 used for a load switch application? For 1A DC current, the conduction loss is only 27mW. This FET is overkill for this application. What is the maximum voltage the FET will see? If the customer needs a 100V FET, a smaller, lower cost alternative would be the CSD19538Q2 in 2x2mm SON. The estimated conduction loss is 115mW. The temperature rise will be 0.115W x 65degC/W = 7.5degC.

    I am including links below to our load switch FET selector tool and to a technical article on how much power each of our FET packages can typically dissipate.