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TPS745:

user6006290
Prodigy 40 points
Part Number: TPS745

I am considering using TPS74501PDRVR.
In the data sheet 24p "10.1 Layout Guidelines",
"Do not place a thermal via directly beneath the thermal pad of the DRV package. A via can wick solder or solder paste away from the thermal pad joint during the soldering process, leading to a compromised solder joint on the thermal pad.", But in "Figure 50. DRV Package Layout Example" of "10.2 Layout Example", it seems that there is a thermal via directly under the thermal pad.
Is it okay to place the via under the thermal pad?

  • 0
    TI__Guru 50025 points

    Hello,

    It is generally fine to place thermal vias under the thermal pad. However, you should take extra care to be sure that there will be enough solder for the thermal pad connection while also not shorting the pins to the thermal pad.

    Best regards,

    Nick