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BQ76940: copper ion migration issue

Part Number: BQ76940

Hi experts, 

My customer used spark gap in their design . the gap is 0.2mm. they also used this between PACK+ and PACK-.  but recently, they found some of their PACK+ line on their PCBA  was carbonized. they didn't meet this issue before. just  in this design with spark gap.  they suspected it could be a copper ion migration issue due to this very small 0.2mm gap.  could you please suggest:

1. Are there any cautions when using spark gap? what's relationship between the votlage and the gap?To be more specific,  if the voltage between PACK+ and PACK- is 36V, What's the suitable gap distance. 

2. if have to use some protective covering on spark gap, What might be the problem?