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TPS53355: TPS53355DQPR Thermal Cooling

SAMBIT ANSHUMALI PARIDA
Prodigy 40 points
Part Number: TPS53355

We have used TPS53355DQPR to design a VR with below spec. Do we need a heat sink or GND thermal pad is good enough to cool. It is 16 layer board where we have GND on TOP (under the IC) and 6 inner layer.

Design Spec

VIN - 12V

Vout - 3.3C

IOUT TDC(designed for) - 23A (actual Max load 20 Amp)

IOUT Step - 10.6Amp

SW Freq - 500 KHz

  • 0
    TI__Genius 17905 points

    Hi SAMBIT ANSHUMALI PARIDA (6259951),

    Do you know the effective ambient temperature in the system?

    Please take a look in the datasheet p.14 for Figure 32 and 33 Safe Operating Area curves for 12V input and 1.2Vout and 5Vout, respectively. Your 3.3V output case will lay somewhere in between. This SOA data was taken on the EVM which is a 6-layer board and probably smaller than your board, so your thermal performance on your 16-layer board could run cooler than the EVM.

    Based on the SOA curves in the datasheet, I would expect that if your system ambient temp is <75-80degC, you may not need to add any additional thermal management other than good thermal pad layout with many vias to the many internal GND layers.

    Regards,
    Kris