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TPS62088: What are the difference between YFP and YWC package except for the height difference?

Shawn_Wang
Expert 3811 points
Part Number: TPS62088

Hi team

The customer is interested in TPS62088. I am wondering if you could help explain the difference between TPS62088YFP and TPS62088YWC? 

The height and the pitch distance are different, but I don't know how to choose a suitable package for the customer. 

Thank you.

  • 0
    TI__Expert 3811 points

    Is there any difference in the aspect of performance for these two packages? The customer needs an evaluation board but I find two boards:

    TPS62088YWCEVM-084  and TPS62088EVM-814

    Which is the better choice? The customer cares about solution size, power consumption, and low output ripple.

  • 0 in reply to Shawn_Wang
    TI__Mastermind 36681 points

    Hello Stone,

    In terms of electrical characteristics (solution size, power consumption, and low output ripple), the YFP and YWC versions have almost identical performance. The main difference between the two package versions is the thermal resistance characteristic. YWC package offers lower interconnect thermal resistance due to wider pin footprints/land patterns, so the device can transfer the heat better from the die to the PCB traces, which results to lower device temperature.

    If the customer has a limited solution area, YWC (PowerWCSP) package would be a better fit because it can dissipate the heat on the PCB better than the YFP package.

    Best regards,

    Excel