CSD95490Q5MC: Thermal metric of θJA

Hi Tiger,

Thank you for your interest in CSD95490Q5MC.

Since junction to ambient thermal impedance is rarely used for application purpose, we use junction to board thermal impedance (1 degreeC/W) which is determined with the device mounted on a 1-in2 (6.45-cm2), 2-oz (0.071-mm) thick Cu pad on a 1.5-in × 1.5-in, 0.06-in (1.52-mm) thick FR4 board based on hottest board temperature within 1 mm of the package. The junction to board thermal impedance may affected by the PCB design, it could be smaller with larger board area and heavier copper.

Best,

Qingquan