Hi,
LM5155 is WSON package. I can find the following sentence on application note : "QFN and SON PCB Attachment" [SLUA271] P.15.
https://www.tij.co.jp/jp/lit/an/slua715/slua715.pdf
the side terminations are not plated. While it can appear the wetting is reduced on the side of the component, the solder joint underneath is not affected.
Is this same as LM5155-WSON package? Please let us know.
Thanks and best regards,
M.HATTORI.
