TPS548D22: how much pressure can TPS548D22 withstand？

Hi Oliver Ou, let me check with our team if we have this information. Is the reason for the question because the customer wants to mount a heatsink on the device?

Hi Kris,

Yes, there is a thermal gasket on the top of TPS548D22, it would generate a certain pressure.

Hi Oliver Ou, I am still trying to get help from product team if we have this data, but we may not have a known pressure limit. Can you share what the pressure (assume in units of N?) will be applied by the gasket to the top of the device?

Hi Kris,

Yes, the  unit is N.   Thanks.

Hi Oliver Ou,

I heard from our product engineering team that max recommended placement force is 1.5N during board assembly process, to avoid solder paste bleeding out and causing shorts. There are other consideration factors for assembly discussed in this application note.

However, this information may not pertain to the heat sink pressure to the top of the device which you are referring. At this point, I do not think we have data on the allowed top pressure on the device due to a heat sink/gasket.