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TPS53319: About OVP pin processing due to data sheet changes

Part Number: TPS53319

Hi,

The recommended OVP pin processing has changed due to PCN.
Customer designed based on the data sheet issued in the past.
Let me ask you two questions in the background.

1.Customer has opened the OVP pin for TPS53319.
  Because in the past datasheet it was not deprecated.
  Is it a problem if it remains open?
  Customers already have applications in mass production and want TI's view.

2.Could you tell me the background behind the changes to the OVP content?



Best regards,
Yusuke

  • There is no change to the IC die, testing or package on TPS53319. If customer is using the device with an open ROVP

    expect the device to perform the same as prior to PCN. The PCN is a recommendation on usage.

    ROVP is an high impedance input (1.5MOhm resistor to ground) which is next to a LL pin which is switching and noisy.

    It is best to place input pins into states that are certain for predictable operation.

    Using resistors to adjust the ROVP threshold on the pin or grounding the pin are the two defined states.


    Though very rare floating the pin, can cause an indeterminate state on ROVP since noise and the pcb layout MAY interact.

    The interaction has strong dependence on the quality of the pcb layout.

    PCB layouts that do not follow the datasheet layout recommendations are more susceptible,

    the LL and BST trace should be greater than 5 mils from an open ROVP pin.


    If there is pcb redesign of a layout using the device, recommendation is to ground ROVP pin if ROVP pin not used.


    We updated the datasheet to reflect the best practices of using the device. There was no change to the IC, test or package.

    To recover from latch off, the input supply or enable pin should toggled from high to low to high to restart.

    Do not recall product in the field. We recommend on new designs to connect ROVP to GND if ROVP not used.