Other Parts Discussed in Thread: LM5005,
Hello all,
We have a system with the following specs:
- Vin typical of 48V, max of 72V
- Vout of 4V going to a GSM module
- Iout in idle scenario is 40 mA
- Iout average when communicating 600 mA
- Iout peak of 2A for a period of 577 us with an interval of 4.6 ms. Max drooping of Vout can be 0.3V at this point.
- Cost sensitive application
Here's the schematic and layout that we are thinking of implementing for this design:
1. The spreadsheet calculator said we'll need about 22 uF as input capacitance. Since it needs to be a 100V rated capacitor, we've added a 2220 package 4.7uF ceramic cap for low ESR and a 22uF electrolytic cap. Would the circuit work without the ceramic cap and only the electrolytic one to reduce cost?
Here's the layout with top layer and the bottom layer is all ground plane.
2. We're planning to use the WSON package for lower pin inductance and thermal properties. Is this package capable of handling an input voltage of 70V? The distance between the input pin and ground exposed pad in the bottom is quite small. Is this okay?
3. We tried to keep the two loops in the buck regulator small and also the diode ground connection close to the input cap's ground. Is there any issues that we've not considered in this layout?
Thanks, Prithv