• State Resolved
  • Locked Locked
  • Replies 1 reply
  • Subscribers 63 subscribers
  • Views 314 views
  • Users 0 members are here
Support feedback
Options
Options
Related

This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

UC3842 SMD package soldering process

Reema Chahande
Intellectual 330 points

Hi Team,

 

We are using your PWM controller IC- 3842 in our SMPS.We have selected SMD package.Our board is the combination of through hole components and SMD components.We are using single side PCB.So first we are fixing all SMD components including your IC 3842 with glue on bottom side of the board and afterwards we are inserting all through hole components and passing the same through wave soldering machine with LEAD temperature @240 deg C.and conveyor speed 110 cm per min.While soldering all SMD active devices and passive devices are passing through LEAD bath. But in testing we are finding that many ICs are failing.

 

Please give us suitable suggestion to avoid this failure.

 

Thanks & Regards,

Reema Chahande