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Original question:

UCC28780: Optimal leakage inductance for high efficiency

UCC28780: Performance difference due to package difference

Tak
Intellectual 480 points
Part Number: UCC28780

Dear Ulrich

I designed a 200W power supply using the UCC28780 for audio amplifiers.

In the first trial, I used UCC28780RTE (WQFN-16) .
It was very difficult to replace the parts every time it failed.
Therefore, I would like to use UCC28780D (SOIC-16) for the next prototype.
Is there a performance difference due to these two shape differences?

Eventually, I'm going to use WQFN-16.
However, at least for the next trial, I think we should choose a shape that is easy to replace.

B.R. Tak

  • 0
    TI__Mastermind 40580 points

    Hello Tak-san, 

    Thank you for your interest in the UCC28780 ACF controller. 

    There is no significant performance difference of the IC between the two packages, except that the WQFN device has a thermal pad whereas the SOIC does not.
    Despite the lower thermal resistance of the QFN, there is not very much dissipation in either package (unless the REF pin is heavily loaded) to make a significant difference in temperature rise of the junction compared to the usual external ambient temperature.  

    Regards,

    Ulrich

  • 0 in reply to Ulrich Goerke
    Intellectual 480 points

    Dear Ulrich

    Thank you for your advice.

    Also, if I have other questions, I will post them again .

    B.R. Tak