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CSD17579Q3A: Metallized Feature in Q3A Package

Martin Schmid
Prodigy 10 points
Part Number: CSD17579Q3A

In the Q3A Package Dimensions Drawing there are Mettalized features wich do not exist in the Q3A recommended PCB Pattern:

There is a remark 4) 'metallized features are supplier options and may not be on the package'

We have built the pad without the features and are now anxious about short circuits that could appear with the features.

Is it better to put copper keepouts in the area of the features?

  • 0
    TI__Expert 7905 points

    Martin,

    Thanks for your interest in our devices.

    If you follow our recommended footprint we are confident you will not have any issue, we sell this package in high volume to many customers and have never seen an issue with this footprint recommendation.

    Consulting with some of our packaging/SMT experts in TI:-

    The recommended PCB land pattern didn’t have the protrusion/metalized features for a couple of reasons:

    1. As note 4 indicated, some suppliers may not have this protrusion features. If we put a land pattern with solder paste and without component pad, there
      is a risk of creating solder balls.
    2. This protrusion feature has some sharp corners and can trap chemical during PCB fabrication process. Not a prefered way for PCB layout and fabrication.

    It sounds like you have some concern about solder shorting if the PCB doesn’t have pads for the protrusion.

    Can you provide any more details on your concerns and we will see if we can address them specifically.

  • 0 in reply to Chris Bull
    TI__Mastermind 38450 points

    Hi Martin,

    Thanks again for your interest in TI FETs. I am following up to see if this has resolved your issue. If I do not hear back from you in 24 hours, I will assume your issue is resolved and close this thread.