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LM60440: Thermal performance

Y.Ottey
Mastermind 6145 points

Part Number: LM60440
Other Parts Discussed in Thread: LMR33630

Dear TI Team


If you check the following New Product Update document p.6,
It is stated that the thermal performance of the LM60440 is superior to that of the LMR33630.

https://www.ti.com/lit/ml/slpp107/slpp107.pdf?ts=1614524135843&ref_url=https%253A%252F%252Ftraining.ti.com%252F

I think the reason for this is that the LM60440 package has a DAP, but the LMR33630 does not.
(Because heat dissipation is larger with DAP, thermal performance is better)
Is there any other reason why the LM60440 has better thermal performance than the LMR33630?

Best Regards,
Y.Ottey

  • 0
    TI__Mastermind 27490 points

    Hi

    one reason is the thermal DAP, another reason is its max Tj for normal operation is go higher to 150deg C which allow it has more derating room compare to LMR33630

  • 0 in reply to Daniel Li14
    TI__Guru 50120 points

    Hi,

    It depends which package technology you are looking at for the LMR33630. When comparing LM60440 WQFN13 to LMR33630 VQFN then the DAP on LM60440 will provide better performance. If you compare LM60440 WQFN13 to LMR33630 HSOIC, then the larger DAP on LMR33630 HSOIC would provide better thermal results.

    Note that the LM60440 is categorized as having an "enhanced QFN" package, which utilizes the strengths of HSOIC and HotRod to provide a thermally robust low noise design. I would suggest customers look at using the LM60440 for newer designs.

    Regards,

    Jimmy