RE: PTD08D210W: Recommended land pattern

The PTD08A020W has the land pattern on page 14 of its datasheet. See the bottom left hand corner. For the PTD08A020W, I see it is a through hole package so there is not thermal pad to get heat out of the module. This one is a through hole package because it is a double sided module. So the primary thermal interface between the through hole module and the PWB will be through the large power pins.

I personally do not have much experience with the through hole modules to give an estimate how much this module depends on dissipating heat on the PWB. I imagine some heat will conduct through the large power pins into the PWB but I'm not sure how much. In general if you can maximize the size of the copper pours for the power planes this module is connected to it may help with thermals. This would also help with minimizing resistance and losses in the PWB. When it comes to determining if it will work in your application, the SOA curves on page 6 through 9 should hopefully help.

Anthony, do you know if this item is suitable for use in a vacuum environment?    Would you refer me to your colleague that is familiar with this part or similar to ask more detailed questions per your reply that you are not familiar with this component type?  Your previous reply has been useful and provides a good start.  Appreciate it. 

Hi Daniel,

I'm checking to see if I can find more details on this.

Anthony,  would it be of value to explore the option to apply thermal management to this part via thermal interface material and heat sink to the top of the electrical components?    If the environment drops below -40C to apply heat to them.  If the components heat up, to have a secondary heat path out of the part.  The primary heat path being the pins of the part.   

Would TI have a 3D CAD model of this part?

Hi, 

Anthony will feedback to you soon.

Hi Daniel,

I think adding a heatsinking to the top of the components on the module will definitely help provide a secondary path to get heat out of the part. I am checking to see if we have tested this at all ourselves.

I am also looking into if we have a 3D model. I couldn't find one in the usual places.

Hi Daniel,

We have not tested using heat sinking to the components to the top of the module so I cannot say how much it will help.

When you asked about using this device in a vacuum environment, were you just wanting to assume no airflow within an enclosure so no heat transfer due to convection? Then, outside the enclosure is not a vacuum so heat can transfer due to convection into the environment?

We have a 3D model but it was designed a while ago in Mechanical Desktop and we are unable to open it now. If you can accept this file type we may be able to share it as is but we would not be able to check to make sure it is accurate. We can make a new one if that doesn't work.

The environment that the component is exposed to is a vacuum environment.  In a vacuum chamber.  Thus, the heat transfer option to use is conduction.   Convection is not an option.   As is, the heat transfer option is out the pins and to the PWB.   If that is not sufficient, the question is to identify the components on the part that are producing heat on the top surfaces to entertain extracting heat from them via a thermal interface material to a custom heat sink on top.   If this makes sense.

Yes, send the CAD model.  I can see if I can open it.   If not, I would appreciate if Texas Instruments would be to make a 3D CAD model.

Got it. Thanks for the further detail.

3D files can be downloaded from the link below. I was able to open them up myself with a viewer fine so they may work for you.

/cfs-file/__key/communityserver-discussions-components-files/196/PTD08A20_5F00_3D.zip

The files are 2D - electronics drawings.    Would you be able to provide 3D part or assembly files in step, igs, or solidworks format?

Hi Daniel

     We have requested for a 3D step model with the modeling team. We will give you an answer by Tuesday to confirm if we can create one.

Regards,

Gerold

Anthony,  

Would you be able to provide a 3D model created in step format for part PTD08D210W? 

Apologies for the delayed reply for the requested for 3D model of PTD08A020W.    I had pivoted to another project and had taken some needed vacation time.   Circling back to this thread.  Thank for the CAD file.  I have downloaded it.   It is not complete.  Attached is .jpg comparison to the datasheet image. 

Hi Daniel,

I will follow up with the person who helped create this. You are looking for all of the missing passives (like the caps and FETs) to be added to it, right?

Great question.   I'd prefer a complete 3D representation of the two PTD parts.  However, I'm learning that sometimes ECAD and MCAD remove/ignore components during handoffs based on the intent.  For example, if MCAD is only interested in mating and heat dissipation features then ECAD would only supply (turn on in ECAD) those.    I'm also learning that the heat produced is dependent on use.  Thus, the request for a fully representative 3D file.     Does this make sense? 

Hello Anthony,  would you be able to provide a complete 3D model (with passives) of component PTD08D210W? 

Hi Daniel, I missed that you had requested the step file for that one as well. I will request it from our packaging engineer.