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Do I need thermal treatment on tracks?

Anonymous
Anonymous
Other Parts Discussed in Thread: TPS54310

Dear John,

 

Just like for any circuit, the sum amount of current goes through all pads, tracks and vias associated with a TVP54310 regulator back to it equals the amount of all power supplying current going out from it.

 

 

 

 

So with these outgoing currents, do we need any special thermal treatment, such as using  direct connect via to power ground?

 

I checked Spectrum Digital’s EVM6437 PCB layout and found they use thermal relief contact for vias going to the power plane.

 

The basic question is that where are heat generated? Does it generated primarily at the internal of the regulator? If so, then there should only be thermal pad (PowerPad) placed underneath it; if the heat is also generated at tracks carrying power current out from it and carrying GND currents back to it, then there  also needs to be treatment for tracks.

 

So what is the case? Do I have to pay special attention to tracks?

 

 

 

Zheng

  • 0
    TI__Guru**** 191445 points

    Almost all of the power is dissipated in the high and low side FET switches.  these are internal to the TPS54310.  There is also some significant amount of power dissipated in the output inductor.  The power in the input and output cpacitors due to RMS ripple currents is quite small and can be ignored so long as the ripple currents are within the spec of the respective capacitors.  So it is ok to use thermal relief for all but the vias associated with the powerpad connection. 

  • Anonymous
    0 Anonymous in reply to JohnTucker

    Dear John,

    I see it, many thanks for the answer.

    JohnTucker said:

    There is also some significant amount of power dissipated in the output inductor.

    But no special treatment for the inductor (L52 in the above image)?

     

    Zheng