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TPS61070: Overheating issue during PCB manufacturing process

Josef Alt
Intellectual 1605 points
Part Number: TPS61070

Hi,

my customer experience problems with TPS61070 during manufacturing. Please advise what can be done to isolated / fix the problem: 

TPS61070DDCR is used in one of our PCBs as booster to generate from an input voltage of 3,3 V an output voltage of 5,0 V.
Testing the PCB (after the PCB assembly) with an In-Circuit-Test (ICT) the output voltage is at 5 V -> so the PCB and the part is working fine!
But after the assembly process of the device (in which we mount this PCB) when we perform a Factory Acceptance Test (FAT), we have had a few cases in which this part is not functioning correctly.
Then we (have to) disassemble the PCB and found one of the two following problems:
1. the part is heating up with an output voltage  of around 3,1 V  (instead 5 V).
2. the part is "dead" with an output voltage of 0 V.

Since this problem occurs frequently
we want to discuss, whether this is a known topic and there are already some possible solutions. Or whether we may have a circuit error on the board (design fault from our side).
Or whether we have a faulty charge which we have to claim then.

Thanks 

Josef 

  • 0
    TI__Guru 68535 points

    Hi Josef,

    Thank you for posting but I am a little confused by your description.  Did you say the TPS61070 was on one PCB which passed the ICT, and this PCB went through additional assembly process?  What is the additional process?  Is the TPS61070 subject to some extreme temperature stress in this additional process? 

    Our experts are currently on national holidays (May 1st International Labor Day).  Please clarify the issue and we will try to help you.  I also notify our experts such that they may respond as soon as they are back to work after May 5th.

    Thanks,

    Youhao Xi

  • 0
    TI__Mastermind 46905 points

    Hi Josef,

    i guess the IC is damaged. please try to replace the IC with a good sample to confirm this.

    if the IC is damaged, the possible reason is

    1. as this device doesn't have OVP function. if the FB is touched during the assembling, the device could be damaged. try to change the feedback resistor to smaller value

    2. the layout of the device is not good, and high spike in SW pin destroy the IC.

  • 0 in reply to Jasper Li
    TI__Mastermind 46905 points

    Hi Josef,

    any update of this case?