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TMS320C6655: Solder ball diameter

Part Number: TMS320C6655

Hi Team,

Our customer is looking for the solder ball diameter of the TMS320C6655CZHA25. Page 243 of the datasheet shows the solder ball diameter as 0.45 min and 0.55 max. Our customer would like to clarify what does the 0.25 and 0.10 diameter means.

https://www.ti.com/lit/ds/symlink/tms320c6655.pdf#page=243

Regards,

Danilo

  • Hello Danilo, 

    Geometric dimensioning and tolerance (GD&T) can be a complex subject, but in summary:

     - 0.25 M CAB means the true position or position tolerance of the BGA pad grid array

    - 0.10 M C means the true position or position tolerance of the via within respect to the solder ball profile 

    Basically, the center of the solder ball lies within the pad and via location.

    Regards,

    Kyle