AM62L: Leaded BGA solder finish

Engineer

Part Number: AM62L
Other Parts Discussed in Thread: AM625

Hello,

Do you provide leaded BGA finish for these processors: AM62L31BOGHAANBR and AM6234ATCGGAALW?

Thank you.

0 Engineer 10 months ago

If not, do you happen to provide them in a different non-BGA package?

0 Kallikuppa Sreenivasa 10 months ago in reply to Engineer

Hi,

Thank you for the query.

Please refer below currently supported package.

11.9mm × 11.9mm, 0.5mm VCA, 373-pin FCCSP11.9mm × 11.9mm, 0.5mm VCA, 373-pin FCCSPBGA package (ANB)

Regards,

Sreenivasa

0 Kallikuppa Sreenivasa 10 months ago in reply to Kallikuppa Sreenivasa

We have similar specs for the Am625 for reference as i check on the AM62L.

I would expect this finish to be similar and checking to confirm.

AM625 -> ALW pkg: ball diameter 0.3mm : substrate pad 0.25mm
The recommendation is 1:1 ratio between PCB pad and substrate pad.

Section and Document reference:

. Width/Spacing Proposal for Escapes

The recommendation is to use 0.25mm (10 mil) BGA landing pads to meet the requirements

Lead finish/Ball material

SnAgCuBi

Regards,

Sreenivasa

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