TMS320C5517 footprint

Muta

Other Parts Discussed in Thread: TMS320C5517

I got CAD data on TI web and confirmed pad dimension with TMS320C5517 ZCH package.

I feel pad dimension of ball is large for actual ball size. Could you verify if this pad diimension is correct or not ?

Pad dimension of ball = 0.46mm

Package ball size = 0.36mm(min)/0.46mm(max)

In our experience, the pad dimension is not same as max size of ball, slightly smaller than ball size.

If you have any other document for pad design of this package, woud you please send me it ?

Your commnets would be highly appreciated.

0 Mark M over 9 years ago

Hi Takashi-san,

The C5517 EVM has a pad diameter of 0.36mm (matches the minimum package ball size), and it is proven to work for us.

See the .BRD file (Allegro 16.6) - http://support.spectrumdigital.com/boards/evm5517/revf/files/evm5517_Layout_revf.brd
   - open with Allegro/OrCAD FREE Physical Viewer (http://www.cadence.com/products/pcb/pages/Downloads.aspx)

See the Gerbers - http://support.spectrumdigital.com/boards/evm5517/revf/files/evm5517_Gerber_revf.zip
   - open with a gerber viewer

Allegro measurement
   pad radius = 0.1796 mm
   solder mask radius = 0.2095 mm (approx, measure tool issue)
   calculated pad diameter = 0.3592 mm
   calculated mask radius = 0.419 mm (approx, measure tool issue)

These measurements match the dimensions in the package drawing and package CAD file on www.ti.com/.../quality

C5517 package drawing on http://www.ti.com/lit/ml/mpbg842c/mpbg842c.pdf also confirms BGA ball diameter 0.36 to 0.46 mm

TMS320C5517_ZCH_196.bxl http://webench.ti.com/cad/dlbxl.cgi/TI_BXL/TMS320C5517_ZCH_196.bxl can be imported into your favorite cad tool for verification