TDA2EG: Thermal considerations

Elanchezhiyan V

Prodigy 20 points

Part Number: TDA2EG

Hi,

Is there any Thermal Consideration document for TDA2Ex SoC which Captures the below parameters,

Power Consumption Characteristics
Temperature Ranges
Package Characteristics
Thermal simulation results
Heat Sink Recommendations
Thermal Improvements

over 8 years ago

0 Lyuben Aleksiev over 8 years ago

TI__Prodigy 515 points

Hi Elanchezhiyan,

Please refer to the following documents:

Regards,
Lyuben.

0 Yordan Kamenov over 8 years ago

TI__Mastermind 42515 points

Hi Elanchezhiyan,

I have forwarded your question to an expert.

Regards,
Yordan

0 kcastille over 8 years ago in reply to Lyuben Aleksiev

TI__Guru 56247 points

Elanchezhiyan,

Please contact your local TI support rep for help with power estimation for your use case.

The TDA2Ex is spec'ed for junction temp between -40 C and 125 C. It is the customer system's responsibility to design the chassis, heatsink, and airflow to dissipate heat given the end system's required ambient temp. We often see systems designed for 85C ambient that use the chassis itself as the heat sink/heat spreading mechanism.

We offer a thermal model for the SoC available here:

www.ti.com/.../sprm682

This model (along with model of your PCB, other ICs, chassis etc) can be used in a tool like Flotherm to help guide your design decisions.

Regards
Kyle

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TDA2EG: Thermal considerations