Other Parts Discussed in Thread: TMDX654IDKEVM
Hi TI Experts,
I am involved in the design of a PCB with Sitara AM6548 processor on it. On this board we are using the DDR3L memory from Micron. We are using the TMDX654IDKEVM as a reference.
My question is related to the DDR3L traces impedance on the EVM pcb. I noticed that the layer stack-up parameters are the same as described in the document sprac76c and also on the EVM schematic. The single ended impedance is 39 Ohms and the differential impedance is 78 Ohms. However, this is not consistent with the recommendations from the document spraci2 - AM65x/DRA80xM DDR Board Design and Layout Guidelines (single ended impedance between 40 and 50 Ohms).
Can anyone explain what are the reasons for different impedances on the EVM board and in the AM65x/DRA80xM DDR Board Design and Layout Guidelines?
Best regards,
Zoran