DM8148 package drawings and info CYE (S-PBGA-N684)

Todd,

we are not sure we understand your requested. The drawing is pretty detailed. Can we ask what info is missing that you are looking for. I cant think of any more details that can be added to the drawing itself. We don’t list material content on the drawings.

BR,

Viet

6825.BGA_pic.doc

What are the A & B dimensions of the ZRC98 BGA Microstar Junior package for the TPS659113 and the CYE (S-PBGA-N684) package for the TMS320DM8148.

Pick a diagram in the picture, NSMD or SMD, for each of the packages referenced above and please supply the “A & B” dimensions with their associated tolerances, as applicable.

Hi Todd,

Please see the DM814x_PWB_guidelines.pdf attached.

BR,

Viet

Thank you.

Do you have access to the same document for the other part mentioned above  TPS659113  ?

Hi Todd,

The document for TPS659113 is avail to download from here:  http://www.ti.com/lit/ml/mpbg381/mpbg381.pdf.

BR,

Viet

For the CYE (S-PBGA-N684) package for the TMS320DM8148 my customer is going to re-ball the package

to leaded balls and needs to know the plating of the package,etc in order to know what temperature profile to use.

If we could get a cross section picture of the package that would help as well?

Also if my customer could contact the package manufacturer that would be helpful as well to ensure they

perform the re-balling correctly, who is the package manufacturer?

Todd,

Texas Instruments strongly discourages the use of reballed devices for production purposes.  Additionally, reballing a Pb-free device with Pb-Sn balls should be avoided.  The solder balls on the CYE are PbFree SAC305 and the metallurgy of the BGA substrate pad is formulated for this metallurgy. Removing these balls and replacing them with Pb-Sn balls poses several significant risks.  These may include incompatibilities between the Pb-free and Pb-based metallurgies and  incomplete removal of all residue from the original Pb-free balls that can lead to both solderability and reliability issues.  Furthermore, the reball operation subjects the units to at least two additional reflow cycles beyond the expected SMT process (remove Pb-free BGAs, attach Sn/Pb BGAs). This imparts additional risk for package damage such as interfacial delamination/cracks in the first level interconnect (bump to die and bump to solder mask).

The CYE_package_cross_section.pdf attached for cross section picture of the package.

Viet

Hi Viet,

I am in a similar position to Todd.  My project is an aerospace application and ROHS (lead-free) solder balls are not permitted.

Only leaded solder balls are allowed for BGAs.  If TI does not recommend re-balling, can the DM8148 be provided with leaded solder balls?

Please advise.

Thanks,

Mohan Gurunathan

Principal Design Engineer

Nuvation Engineering

San Jose, CA

Hi Mohan,

Moravec, Lori should contact you shortly on this.

BR,

Viet

Hi Viet,

Can TI provide the smt profile on dm8148? Thanks a lot.

B.R.

OC

Hi OC,

Yes, but this infor need NDA.  Could you get them from local sale or FAE for it?

BR,

Viet