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66AK2G12: Heat sink required for 1GHz variant device ?

Part Number: 66AK2G12

Hi,

Can you comment if 66AK2G12 running at 1000Mhz is required to use heat sink mounted on the device ? As you know, heat sink is not being used in EVM environment, but in general, i think it would be required for the custom board. I believe this is based on the actual use case, but do you have any guideline for heat sink ? for example, part number information, air flow recommendation and etc ... 

Best Regards,
NK

  • Hi Naoki,

    Per my understanding you can use the Thermal Design Guide recommended for all other Keystone II devices:
    www.ti.com/.../sprabi3b.pdf

    It is a general design guide for arm & dsp application processors.

    Best Regards,
    Yordan
  • Hello, Yordan.

    Thanks for your suggestions. I run my eyes through the document and it looked good material. I understand whether the heat sink is required or not is ultimately application specific and TI would not be able to provide any specific recommendation for such kind of issue. Maybe you are right, but instead, do have any information of other customer's experience for heat sink on 66AK2G1x ? -- For example ,yes, some customers have made a decision to use heat sink with 66AK2G12 1Ghz and etc -- such kind of information would be also helpful. Of cause, i know we should refer without any warranty and complaints even if you could.

    Best Regards,
    NK
  • Hi,

    do have any information of other customer's experience for heat sink on 66AK2G1x ? --


    No, I don't have feedback from customers. In general, if your design allows it, placing a heatsink on the SoC can only benefit the design, as it will improve the cooling of the chip.

    Best Regards,
    Yordan
  • Ok, thank you, Yordan. We will talk with the customer base on the information shared here.

    Best Regards,
    NK