Hi,
we are using AFE7769 in our design due to layout constraints we want to route TX differential signals to BALUN in the inner layers Kindly confirm if it's a feasible solution to our case and Give your valuable comments
Regards
Pavan Kalyan
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Hi,
we are using AFE7769 in our design due to layout constraints we want to route TX differential signals to BALUN in the inner layers Kindly confirm if it's a feasible solution to our case and Give your valuable comments
Regards
Pavan Kalyan
Pavan,
The components soldered on the Tx differential signal path are used for matching purpose. With the Tx differential signals routed on the inner layers of the board, it may be difficult to adjust the values of the matching components if it doesn't meet the -10dB return loss spec. In addition, depends on the layout and the # of layers inside the board, having the high frequency signal on the inner layer may cause unwanted coupling and possible interference with other signal path. In theory, it is feasible, but not recommended by TI due to the reasons mentioned above.
If customer does decide to route the Tx differential signal on the inner layer of the board, it is better to have several smaller vias than one large via. This design choice reduces inductance and provides additional paths for current in case one of the vias fails.
Kevin