Other Parts Discussed in Thread: AFE7950
Tool/software:
Subject: Inquiry About Bare Die Availability of AFE7950 for Custom SiP Integration
Dear Texas Instruments Support Team,
I hope this message finds you well.
We are exploring the possibility of integrating the AFE7950 RF transceiver into a custom System-in-Package (SiP) design for an advanced wireless application. To achieve optimal performance and miniaturization, we require the bare die version of the AFE7950 rather than the packaged IC.
Could you please confirm:
- Availability: Is the bare die of the AFE7950 available for purchase?
- Technical Documentation: Are die specifications (pad layout, bonding diagrams, thermal/mechanical data) accessible under NDA?
- Minimum Order Quantity (MOQ): What are the commercial terms for die procurement?
- Alternative Solutions: If the bare die is not available, does TI offer an equivalent die-level solution or a compatible SiP-friendly variant?
This request is for a high-reliability application, and we are open to signing an NDA or discussing partnership opportunities if needed.
Thank you for your time and assistance. We look forward to your guidance on how to proceed.
Best regards,