Hi joe,
We have initially procured GC5337 eval board which has provision to test only transmit & DPD feedback chain. modifications in the RX chain was required and it was sent to TI office for rework
we have received the board now and we have the following queries :
1. Rework list which u have sent along with the board doesnt have any changes with RX chain (GC 5337),
2. Document says to enable OMAP's "flash_sel" pin (R176 with 0 ohm) and GP80 from FPGA will be used as an Enable pin "FLASH_SCSN" for serial flash instead of "spi1_enable_in" from OMAP ??
3. why R110 and R167 were removed and DSPI1_SIMO_IN /DSPI1_SOMI_IN connections were interchanged (master and slave) ??
4. kindly let us know if any software changes are required , we will be using the same configuration code in our design .
Kindly explain the purpose why OMAP in this case (after rework) uses serial flash (U43-M25P64)
In our design we will be using serial flash (U43) only for configuring FPGA and not for omap , since omap application code can be configured using Parallel NOR flash (U27-S29GL256P10TFI010).
