Sensors

Sensors forum

State Resolved
Locked Locked
Replies 5 replies
Subscribers 32 subscribers
Views 336 views
Users 0 members are here

Support feedback

Options

Options

Related

AWR1843: Package and reflowing information

Junpei Kishi

Intellectual 865 points

Part Number: AWR1843

Hi team,

Let me ask some questions listed below.

Could you give me a document which shows reflowing profile, baking profile, and storage condition.
The datasheet shows that the ball is SN-AG-CU. Could you let me know composition ratio?
I understood the device is compatible with RoHS. Could you share a file shows material distribution?

Thank you and best regards,
Junpei Kishi

over 4 years ago

0 Ishita Kochar over 4 years ago

TI__Mastermind 31680 points

Hello Junpei Kishi,

I have forwarded your query to our expert here. Please expect a response within 2 days.

Thankyou for your patience.

+1 Vivek Dham over 4 years ago

TI__Guru 58035 points

Hello Junpei,

You can refer to the following app note for flip chip BGA package soldering profile requirements. www.ti.com/.../spru811a.pdf

Yes, the device is RoHS compliant.

Regards,
vivek

0 Junpei Kishi over 4 years ago in reply to Vivek Dham

TI__Intellectual 865 points

Hello Vivek,

Thanks a lot for your telling above.
Let me 2 more questions.

Can you share about #2 ball composition ratio too?

Do you have any document which can prove that the device is RoHS compliant?

Best regards,
Junpei

0 Vivek Dham over 4 years ago in reply to Junpei Kishi

TI__Guru 58035 points

Hello Junpei,

Can you request this information separately since we can provide it only under NDA.

Regards,
Vivek

0 Junpei Kishi over 4 years ago in reply to Vivek Dham

TI__Intellectual 865 points

Hi Vivek,

I understood.
Thank you for your quick responses!

Regards,
Junpei Kishi