OPT3001: Baking time and temperature

Peter Evans

Part Number: OPT3001

Hello Team,

We have a number of OPT3001 light sensor devices which have exceeded their floor life (by several weeks) so presumably need to be baked.

We are keen to avoid damaging the optical properties by over-baking, and as they are in very small, thin packages, we are concerned that the nominal JEDEC figures might be over the top.

Please could you advise on what temperature to bake them at, and for how long, to minimise the risk of damage?

Many thanks,

Peter

over 3 years ago

0 Alex Bhandari-Young over 3 years ago

TI__Mastermind 25895 points

Hi Peter,

Looking into this.

Best,

Alex

0 Peter Evans over 3 years ago in reply to Alex Bhandari-Young

Prodigy 30 points

That's fine - thanks for the update Alex

0 Alex Bhandari-Young over 3 years ago in reply to Peter Evans

TI__Mastermind 25895 points

Should be able to give an update by end of this week

Best,

Alex

+1 Brent Elliott over 3 years ago

TI__Expert 6800 points

Hi Peter,

The Reference Conditions for Drying Mounted or Unmounted SMD Packages table in IPC/JEDEC J-STD-033C should contain the information you need on baking temperature/time.

OPT3001's operating temperature maximum is 85C and long exposure to temperatures higher than 105C can cause package discoloration, spectral distortion, and measurement inaccuracies. Because of this, you will have the option to bake the devices at 90C or 40C, and you can refer to the table I mentioned before on the baking times based on the thickness of the device and the temperature that you choose.

Thank you,

Brent Elliott

0 Peter Evans over 3 years ago in reply to Brent Elliott

Prodigy 30 points

Hi Brent,

Apologies for the delay in replying.

That's perfect - many thanks for your help!

Best regards,

Peter

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OPT3001: Baking time and temperature