Is there any requirements/HW or Layout Design Guide for using IWR6843aop? Is it necessary a special material for the pcb?
Thank you in advance!
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Is there any requirements/HW or Layout Design Guide for using IWR6843aop? Is it necessary a special material for the pcb?
Thank you in advance!
Hello User,
Please refer to the linked document : /cfs-file/__key/communityserver-discussions-components-files/1023/IWR_5F00_AWR_5F00_rf_5F00_design_5F00_fab_5F00_and_5F00_validation_5F00_guide_5F00_rev_5F00_4.pdf
Hope this helps.
Regards,
Ishita
Hello Ishita,
thank you very much for your reply! I find the document very interesting. It is a pity that a lot of the links couldn't be opened but it is a preliminary document, isn't it?
My question was about the PCB to use the AOP Version. I think it is a normal PCB with FR4 Material but it is special for hight temperatur. Do you have more specifi information about this?
Again thank you very much in advance!
Regards,
Enrique
Hello,
For more updated document, you could refer below app-note.
https://www.ti.com/lit/an/spracg5/spracg5.pdf
https://www.ti.com/lit/an/spracx7/spracx7.pdf
AOP hardware could be build with the FR4 material. For higher temperature performance, high Tg FR4 will have better mechanical and chemical resistance to heat and moisture than standard FR4. Hence you could use High Tg FR4 material.
Stackup details are provided below.
For more details you could refer below app-note.
https://www.ti.com/lit/an/swra672/swra672.pdf
Thanks and regards,
CHETHAN KUMAR Y.B.