TMP75: TMP75AIDR - Parts received with lead frame, body marking and dimple differences.

Dear Calvin - 

Thanks for the post - could you also provide images of the backside of these ICs and images of the shipping labels from the boxes these devices were shipped in? 

As attached:

backside of IC

Label.

Dear Calvin - 

Why did you block out the lot # on the sticker and the bar code? We need to know what lot #'s are. Please repost with updated image and the sticker from the other shipment along with backside of other IC. 

Which IC is the image from the backside that you sent? From where did you get those?

Hi Josh

Parts came in early this year and while received in the parts, lot code and barcode have been removed.

Able to advise on the below findings and if it is common to have differences per below?

- Lead frame structure different
- Body marking different
- Dimple different

Thanks

Calvin

Thanks Josh!

Can i add on that on the side of the chips, we are seeing what seems to be sanded and rework. Please advise if this is the case and if its done by TI Direct. Thanks. 

Calvin - 

Another member of my team is looking into this, she will update you as soon as that information comes in. 

Hi Nicole, Josh

thanks so much for your help to clarify on the above mentioned observations!

Facing similar issues on SN74LVC1G11DCKRG4 , which the size and orientation of die and pins seems different. Please review to see if both variants of the IC are correct and can be used.  Thanks

Thanks

Calvin