We use the OPT8241NBN on a PCA. Are there any processing guidelines for the device besides the underfill recommendation? For example, I do not see a reflow profile in the datasheet.
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We use the OPT8241NBN on a PCA. Are there any processing guidelines for the device besides the underfill recommendation? For example, I do not see a reflow profile in the datasheet.
Hello,
Regarding the questions related to OPT8241, please send them to the email list ti-3dtof@list.ti.com along with a reference to this E2E post.
I wrote to ti-3dtof@list.ti.com as suggested and referenced this post. I received an email back telling me the TI was not looking for new 3D TOF applications. So my original question still stands....What are the handling and processing guidelines ( reflow profile, cleaning, etc) for the OPT8241.
Hello,
I am checking with the team for the handling and processing guidelines document.
Most of the team is out for the holidays and hence will get back to you after the holidays.
Hello Norman,
I am closing this post since the information has been provided via e-mail.
If you have any further questions, please reach out via e-mail.
No Email has been received with the processing guidelines. The issue is not closed. Given it has been open for a month, this is really bad service. All I want is the reflow profile, limits on pick and place force, handling guidelines.
Hello Norman,
My Colleague Suramya had sent the email to you and I also see that you have responded in that email thread.
The information he had shared via email is all the information we can provide regarding your questions.
I will close this post now and if you have any further questions, please reach out to us via e-mail.