Hi Ti team ,
I have a question about the VIA specification in the board manufacturing data for the evaluation board (IWR6843ISK).
Is it correct to assume that the hole size ranges from 0mm to 0.15mm according to the following VIA specifications?
For example, is it possible to manufacture with a hole size of 0.1mm?
For the board manufacturing data, I referred to the following document.
SWRC355C.ZIP
www.tij.co.jp/.../swrc355
File storage location
\swrc355\xWR6843ISK_DesignFiles\Rev_D\Fabrication Drawing\PROC073D_FabNotes.PDF
The notation for the figure is on the second page of the PDF file.
Thank you for your kind attention to the above.
Tsutomu Watanabe.