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LM50: Need information regarding Thermal resistance

Part Number: LM50

Hi team,

My customer need assistance.

we are using LM50CIM3 in our design. There is junction to ambient thermal resistance(RθJA) mentioned twice in the datasheet: www.ti.com/.../lm50.pdf

(1) In section 6.4 RθJA mentioned as 291.9 °C/W

(2) In section 10.3 RθJA mentioned as 450 °C/W

We are not able to understand difference between them. can you please help us to understand difference between them.?

Please help. Thanks.

  • Hello Chong,

    There was a change to the RθJA value in revision F of the datasheet to 291.9°C/W.  It looks like table 2 in section 10.3 was not updated.

    Also, take a look at the app note below discussing package thermal metrics.  Section 1.1 shows that the PCB design will have a strong impact on the RθJA.  In still air, 70%-90% of the power generated is dissipated through the board and not the package.  

    www.ti.com/.../spra953c.pdf