IWR6843AOPEVM: About power supply sequence

user1475503

Part Number: IWR6843AOPEVM
Other Parts Discussed in Thread: IWR6843AOP

Hi Experts,

We are currently trying to design a circuit using your IWR6843ARQGALP device.
The same PMIC as the reference board is not available and must be replaced.
What are the restrictions on the power supply sequence for this device?

You can confirm about it in another series at the link below. Is it okay to think of it as the same as the explanation?

e2e.ti.com/.../awr1843-power-supply-sequence-and-xtal-start-up-time

We would appreciate it if you could answer this technical question as soon as possible.

Thank you for your support.

over 3 years ago

0 user1475503 over 3 years ago

Prodigy 30 points

Excuse me. I've missed the link, so I'll post it again.

https://e2e.ti.com/support/sensors-group/sensors/f/sensors-forum/905007/iwr6843-power-up-sequence?tisearch=e2e-sitesearch&keymatch=IWR6843%20Power#

0 Sami Mardini over 3 years ago

TI__Expert 3990 points

Hi,

Please refer to the data sheet for wake up sequence. Here is a snap shot of the wake up sequence.

Regards,

Sami

0 user1475503 over 2 years ago

Prodigy 30 points

Thank you for your support.

I have already checked the figure that you have shown.
As far as this figure is concerned, the order of power supply is not clearly shown as a timing rule.
However, it seems that there is some restriction that 1.0V is woke up first, 1.2V and 1.8V second, and finally 3.3V.
Please tell me a little more about it.

I have another question.

I have checked IWR6843AOPEVM for evaluation board documentation below.
(I'd like to confirm if this evaluation board is equipped with IWR6843ARQGALP device )

　　www.tij.co.jp/.../IWR6843AOPEVM
　　IWR6843AOPEVM Altium Design Files, Fabrication & Assembly Package (Rev. F) — SPRR418.ZIP (18053 KB)

In "PROC091F_PCBlayers.PDF", The thermal pads are drawn on the Top Layer and Bottom Layer.

On the other hand, if you check "LAND PATTERN EXAMPLE" (Page 79) in the following data sheet, the pattern for the heat dissipation is not drawn. Which is correct. What is the rectangle-pattern inside the BGA-Ball in the "PACKAGE OUTLINE" (Page 78)?

　　IWR6843AOP Single-Chip 60- to 64-GHz mmWave Sensor Antennas-On-Package (AOP) Data Sheet (Rev. A)

0 user1475503 over 2 years ago in reply to user1475503

Prodigy 30 points

This screenshot is related to my previous post.

0 Sami Mardini over 2 years ago in reply to user1475503

TI__Expert 3990 points

Hi,

Let me check.

Regards,

Sami

+1 aozer over 2 years ago

TI__Mastermind 26925 points

Hello,

Please see the below app note regarding the thermal considerations for the AoP devices.

https://www.ti.com/lit/an/swra672/swra672.pdf

In addition to the power supply sequence in the thread you have linked, the only other consideration is the possibility of a glitch on the GPIO if the 3.3V supply comes up before the 1.8V supply. Please see MSS#38. It is recommended to power up 1.8V before 3.3V, and all supplies should be stable before NRST is released.

https://www.ti.com/lit/er/swrz092a/swrz092a.pdf

Regards,

Adrian

0 user1475503 over 2 years ago in reply to aozer

Prodigy 30 points

Thank you for your continuous support.

I have a question about Figure 1 of the 3 pages in Application Note "swra672.pdf".

Is there a dimensional drawing that shows the positional relationship between the BGA ball and the die?
Will the exposed dies be soldered directly, or will they be bonded using something like silicone grease?

Best regards,

0 Sami Mardini over 2 years ago in reply to user1475503

TI__Expert 3990 points

Hi,

I am checking.

Regards,

Sami

+1 CHETHAN KUMAR Y.B. over 2 years ago in reply to Sami Mardini

TI__Mastermind 25825 points

Hello user1475503,

The square below is the the exposed die, In this package die is exposed outside the package and mounted to package from the bottom side of the package. This die doesn't make contact to PCB, it's always connected to package.

Die doesn't get soldered on the PCB, However for better thermal performance solder mask opening is provided underneath the die on the AOP EVM which is ground connection connected to other layers of the ground using plated thermal vias.

Thanks and regards,

CHETHAN KUMAR Y.B.

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IWR6843AOPEVM: About power supply sequence