Soldering defect in TMP112AIDRLR

Heidie Ng

Dear all,

Good Day!

This is Heidie from TED APAC.

My customer reported soldering defect in item TMP112AIDRLR.

All of defect occurred in COO: China items but no defect in COO Thailand items. May I know why only COO China items have soldering defect?

Is there any defect report reported from other customers for the below Lot?

China defect rate: 787pcs/1050pcs. around75% (2130, 1310813JCE)

Thailand defect rate: 0pcs (2132, 1801791HNA)

Please refer to the picture from the excel 211224 WA6-2304-000中国製 pw ca40.

Hence, we checked Lead finish/Ball material of both COO and found result as below.

Any reflow condition difference between these two Lead Frame Plating materials?

# reflow temperature at customer production is around 244.73℃

China: NIPDAU

Thailand: NIPDAUAG

We checked reference from TI website below and found both of the materials should be Pb-Free.

If that is correct, customer re-flow temperature did not over the standard. Why there will be such soldering defect on China goods?

Reference

Handling and Process Recommendations ( https://www.ti.com/lit/an/snoa550h/snoa550h.pdf )

And Lead finish composition & Tin plating process https://www.ti.com/support-quality/environmental-info/lead-finish-tin-plating.html

Thanks & Best Regards,

Heidie

over 3 years ago

0 Eddie LaCost over 3 years ago

TI__Mastermind 43580 points

Hi Heidie,

I am looking into the lot codes that you provided, but your image did not come through on the forum. Can you please repost the image? Thanks!

0 Heidie Ng over 3 years ago

Prodigy 20 points

211224 WA6-2304-000中国製 pw ca40.xlsx

Dear Eddie,

Sorry, please see the attached file.

Password is ca40.

Thanks & Best Regards,

0 Mike Yeung over 3 years ago

Prodigy 40 points

Good part that made in Thailand Parts made in THAILAND COO

Defect part which made in China Parts made in CHINA COO

0 Eddie LaCost over 3 years ago in reply to Mike Yeung

TI__Mastermind 43580 points

Hello Heide,

The solder joints on both devices are not ideal. Per table 2 in the handling and process recommendations document, the peak temperature should be 260C for 30 seconds. The package thickness of TMP112AIDRLR is 0.6mm.

0 Mike Yeung over 3 years ago in reply to Eddie LaCost

Prodigy 40 points

Hello Eddie,

Thank you for reply.

Because both me and Heidie are not the technicians, might I get your confirmation about your comment?

Do you mean when customer side doing solder joints with temperature around 244.73℃ is not high enough?

Should our customer use 260℃ for 30 seconds to do?

As my understanding this condition should be Max condition that we should not over. Might we know what is the Min and normal condition to do this solder joints?

0 Josh Wyatt over 3 years ago in reply to Mike Yeung

TI__Guru* 91206 points

Mike -

The team is on Federal holiday today - Eddie will get back to you tomorrow for sure.

0 Mike Yeung over 3 years ago in reply to Josh Wyatt

Prodigy 40 points

Josh,

Noted and thank you for the friendly notification.

0 Eddie LaCost over 3 years ago in reply to Mike Yeung

TI__Mastermind 43580 points

Mike,

Do you mean when customer side doing solder joints with temperature around 244.73℃ is not high enough?

Yes, per the JEDEC standard, the package thickness and volume determine the Tp temperature.

Should our customer use 260℃ for 30 seconds to do?

Yes, this would follow the JEDEC standard.

As my understanding this condition should be Max condition that we should not over. Might we know what is the Min and normal condition to do this solder joints?

260C is the max Tp. Figure 2 shows the recommended ramp. For the 30 seconds at Tp, the temperature should be within 5C of Tp, so a minimum of 255C.

0 Mike Yeung over 3 years ago in reply to Eddie LaCost

Prodigy 40 points

Eddie,

Thank you for your advice. Shall check with customer side and see if any more defect by using advised condition.

0 Heidie Ng over 3 years ago in reply to Eddie LaCost

Prodigy 20 points

Eddie,

We checked with our customer. Please help to answer the below enquiries.

Customer would like to re-confirm that if the temperature is not within 255-260℃, the solder joints won't be ideal ?

Since you mentioned that the solder joints of both COO items are not ideal. Would you please explain it in detail?

Hence, since the Lead finish/Ball material of CN and TH items are not the same. Would there be any difference for the peak temperature and time limit(seconds) if the COO is different?

0 Eddie LaCost over 3 years ago in reply to Heidie Ng

TI__Mastermind 43580 points

Yes, the temperature should be 255-260C per the JEDEC standard for Pb free process.

Even on the Thailand parts, some of the pins look like they are not fully soldered on the sides of the pin. It was good enough to function, but could benefit from the higher temperature as well.

No, they should both use the same Pb free process.

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Soldering defect in TMP112AIDRLR