IWR6843AOP: X-ray inspection to AOP

Hello

Using the reliability information specific to the device from the link you mentioned is the correct thing to do.

It has the relevant data needed to determine suitability of the device for specific applications.

Thank you,

Vaibhav

Hello,

Could you please let me check the details ?

It means that I can beam X-Ray to the special package like AOP under the conditions of this reliability report, is it right ?

Regards,

Hello

We are unable to understand the intent and have sent you questions based on that.

Please check your private messages.

Just to be clear we not see the need for the activity you have mentioned.

Please use provided information on the reliability page about the device in consideration.

Thank you,

Vaibhav

Hello,

I replyed to the private e-mail as following.

Currently, I mount the AOP device board and in the process of X-Ray inspection of the BGA soldering conditions.

I want to just know that the AOP device will not fail if I beam X-Ray to AOP package.

(Because, I think that the AOP package structure is different from the normal.)

Regards,

Hello

Thank you for the information  so intent is to understand the integrity of soldering to the board?

There were a few additional questions:

1. Is this for one time check to understand the correctness of method/process

2. Is this meant to be used on per board basis.

Thank you,

Vaibhav

Hello,

Yes, I am going to check the integlity of soldering to the board.

1. Yes.

2. Yes.

Thanks, regards,

Hi,

I am working with the team regarding your question.

Regards,

Sami