Hello,
I'm currently using the TMAG5170-Q1 for an "in house" sensor design. Our new sensor has been prototyped, I'm now able to compare real measurements to expected one obtained with a 3D Magnetic Finite Element simulation. I’m facing a problem of discrepancy between real and theoretical values (Note: FE models have been already identified with a previous prototype using 2D sensor).
For my application I need to know with accuracy the Hall-Effect sensor position and be abble to correctly identify the following contributions:
- Position of the TMAG component on the PCB (managed by design from my side)
- Position of the Hall-Effect sensor in the TMAG package (values from the TMAG's datasheet).
HE's positions / dimensions are given from the Figure 7-2 of the datasheet and I'm a couple of question to be sure to correctly understand dimensions:
Question 1: From Figure 7-2, I understand that HE's position are given according to the package dimensions with any tolerances (1,54mm from the upper side and 1,77mm from the left side of the package). Do you confirm my understanding? Do you have position tolerances?
Question 2: package's dimensions are given with tolerances (from mechanical data figure), could you confirm if these tolerances have an impact on the HE's position? In fact, if dimensions from Figure 7-2 are constant, HE's position will be impacted according to the plastic package variations.
Question 3: From Figure 7-2, only X,Y and Z dimensions are given and nothing regarding the angle tolerance between the Y axis of the HE sensor and the plastic package. Do you have this information?
I would like to avoid to use the Gain Adjustment function that will be necessary to perform for each sensor manufactured.
Thank you in advance for your support.
Best regards,
Romain
