Are there any TI discussion papers on temp sensing sensitivity - i.e. reaction and stabilizing time .vs. packaging and electrical characterisitcs. For example, what volume of air at del-t is necessary to nudge the reading? For a given product, are there curves for air volume @ del-t .vs. time. Does this need to be humidity compensated? Does it need to be radiation compensated?, supply voltage compensated?
How stable are the MSP430 built in temp sensors .vs. processor usage? I would expect to see a stable reading at low % utilization with a knee at some % point with an error as function of % utilization.
My goal is to use an MSP430 in low power mode with or without an external sensor to achieve a nominal .25F sensitivity over 0-100F range with max .25F del-t detection time of less than 1 minute. In some circumstances I will have RH available, but others normally not. The product package design is an important, but secondary consideration.
What is the consensus?