Hello team,
In the datasheet, the package height is listed as 1.10mm max.
Could you please confirm the nominal height?
Best regards,
Shotaro
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Hello team,
In the datasheet, the package height is listed as 1.10mm max.
Could you please confirm the nominal height?
Best regards,
Shotaro
Shotaro-san,
I have reached out to our packaging team for better clarification for this parameter. I anticipate more information by 3/14/22 for what variance to expect here.
Thank you,
Scott
Scott-san,
OK, I understood. I am looking forward your reply.
Best regards,
Shotaro
Shotaro-san,
Thank you for your patience. We are still communicating with the assembly site to get a clear value for this parameter. I will update you again tomorrow.
Scott
Shotaro-san,
The details I do have so far is that the assembly site is required to meet the max spec as shown in the package drawing, but for most devices this is sufficient, so they don't typically advertise the mean value. We are still working to resolve this question, however. Thank you again for your patience. I will update again by 3/17.
Shotaro-san,
The mold compound thickness is typically within 0.81--0.91mm.
Thank you,
Scott Bryson