Hello,
I am working in the design of a mmWave radar using an AWR sensor, mainly the antenna design. From what I have seen, TI designs either use RO3003 or RO4835 LoPro as the RF substrate. To compensate for the package to PCB transition, you also give an example layout for each of those substrates. I have found all this information in the following link:
Have these transitions been validated experimentally or with simulations? Could you provide more precisse information about the impedance matching for the range 77 to 81 GHz?
Supposing I wanted to use a different substrate or a different package-to-PCB transition, I would need to simulate the effect of the BGA balls, pad, etc... The TX and RX pins are internally matched at 50 Ohms, but where does the 50 Ohm start? Where the BGA ball is in contact with the pad? Where it is in contact with the package?
I also found information regarding the IBIS model of the component, but only the package RLC model, not the pin. Does this model account for the RLC effect of the BGA TX/RX pin ball?
Thank you.
