For the integrated temperature sensor on the TMP513, should we expect it to more closely track the ambient air temperature directly above the chip package? Or will it be closer to the copper temperature that the chip is bonded to (notably the grounded thermal center pad which connects to the ground plane of a board and acts as a heat dissipation surface for other components on the board).
Similarly for remote temperature sensors, would you expect them to more closely track the board temperature directly underneath them (particularly if we have ground poured underneath them), or should they be more closely representing the air temperature around them? We are using MMBT3906 SOT23 PNP Transistors for our remote sensors.
