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Hi all
My customer has this request for the TMAG5110-Q1:
Can you provide the data for CTE (coefficient of thermal expansion) ?
Best regards
Ueli
Ueli,
I assume this is for evaluation stresses during soldering and evaluating over temperature reliability of these joints. This parameter is not characterized on all TI devices, and I do not find data on it for TMAG5110. We can get a fairly close approximation by looking up for the base metal in the lead frame, which is copper (about 17 ppm/⁰C).
Thanks,
Scott