Other Parts Discussed in Thread: LDC1612,
Hello there,
If one want to compensate for L or Rp changes due to inductor temperature change, the usual approach is usage of a
differential coil system, or a dedicated temperature sensor for that matter,
I think this works well if one can ensure good thermal matching characteristic between target sensing coil and
temperature sensor (or differential coil), which implies that those components have to be placed close together
but not too close in order to minimize interferences etc. So if there is a panel of 6 target sensing coils already
close together, it might be challenging to find a good place for differential coils.
My question, would be feasible, or even a good idea, to measure the temperature of the sensing coil more directly?
One approach might be to multiplex the target sensing coil between a LDC device and an independent resistance
measurement facility, by means of analog switches. Since most LDC devices need a MCU anyway, this should not
be too complex. Component count would increase of course, but my point is that those components don't need
thermal matching with the target sensing coils, hence less space constrains to consider.
Just wondering about opinions on this approach.
Regards,
Jo