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MMWCAS-RF-EVM: MMWCAS-RF-EVM antenna fabrication test plan

Part Number: MMWCAS-RF-EVM

Hello,

Regarding de MMWCAS-RF-EVM, in the PCB documentation (Rev. E) it is specified that a special etching tolerance is required in the antenna structures:

In it, it is specified that the PCB dimensions must be achieved as close as possible on the “top” of the resulting etched copper shapes, contrary to what the PCB manufacturers usually do, where the target dimensions are closer to the "bottom" etch. In fact, the bottom etch width has a stronger effect in the characteristic impedance of the line contrary to the top edge.


What is the desired resulting "bottom" etch in this case? Are we aiming for a standard trapezoidal shape as shown in the image or it is better to have a rectangular one? How much wider should the bottom copper etch be?

Thank you.

  • Hello,

    Thank you for reaching out to Texas Instruments. Your request is being forwarded to the concerned department. Please allow them some time to get back to you.

    Thanks,

    -Shareef

  • Hi,

                 the CPWG or microstrip traces are very sensitive to the dimensions and hence for higher tolerance they can behave out of tune, thereby by directly impacting the performance. Typically tolerance allowed is +/-20um or at max +/-1mil. When the PCB's are fabricated these traces tend to have trapezoidal structure however, it is important that the TOP or bottom etch should not be beyond the above tolerance. Ideally it should be a rectangle as the same has been used in the SIMs also.

    Regards