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HDC3022: HDC 3022 Sensor assembly

Michael Vecchio
Prodigy 10 points
Part Number: HDC3022

I am a design engineer creating a 1-Layer ceramic substrate to support the HD3022 humidity sensor. The data sheet calls for a 0.1µF bypass cap to be placed between VDD and GND pins #5 and #8. One option (most simple based on my design constraints) is to rout the ADDR1 and RESET pin traces beneath the HDC3022 sensor and out to the edge of the ceramic carrier. I can then bridge VDD and GND traces with the cap without risk of shorting to ADDR1 or RESET.

This however means the thermal pad beneath the humidity sensor will be in contact with the ADDR1 and RESET traces during measurement.

Is this a problem from an electrical perspective? 

  • 0
    TI__Expert 3270 points

    Hello,

    Thank you for posting to the Sensing Forum.

    The thermal pad must be left floating in order to reduce thermal mass or to measure an accurate ambient temperature measurement. Shorting the thermal pad to ADDR1 and RESET could cause incorrect measurements. 

    Regards,
    Pavani Tenneti